8 Inches Mercury Lamp UV Tape UV Curing Systems Reciprocating Conveyor Belt UV Curing Light Source

 Product Details

8 inch Wafer UV Light Curing Machine reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.

Parameters:

Mode	DSXUV-DG-8	Glass	Quartz glass
Cooling	Air cooling	Irradiation	From top down
Luminous	Mercury lamp (full band)	Power	1-4KW
Lighting area	110*320mm	Intensity	UVA>200mW/cm2
Uniformity	90%	Mercury lamp	2KW*220V*L400mm
Voltage	220V	Operation mode	Motor drive (track slide scan)
Run number	Adjustable (touch screen)	Running speed	Adjustable (touch screen)

Mercury Lamp UV Tape UV Curing System Characteristics:

1.Table type, chain drive

2.Adjustable time and brightness, touch screen operation, simple and convenient

3.Compatible, large size iron rings are compatible with small size

4.Uniformly reduce the viscosity of UV film

5.Fast curing in few seconds

6.Intuitive control panel

7.Enable time control process   

8.Compact design

9.Compliance with the highest safety standards

10.Environmentally friendly

Application for UV Tape UV Curing Systems:

Suitable for semiconductor material like optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk, etc., reducing UV film viscosity like glass filter, UV tape, blue film.

Clamshell 500*500mm UV Tape UV Curing Systems Reducing Blue Film Viscosity

 Product Details

UV tape have strong adhesive strength. Then, tape holds wafer strongly during wafer grinding process or wafer dicing process. On the other hand, adhesive strength becomes lower when UV(Ultraviolet light) is irradiated. So, wafer or chip is easily removed after UV irradiation.

Parameters:

Name: Customized UV Tape UV Curing Systems

Type: DSXUV-500500

Driving: 100-240V 50-60Hz

Color: white, blue

Power: 7000W

Outside dimension: 925*650*975mm

Irradiation Area: 500*500mm

Function: adjusting time and power (1-100%)

Wavelength: 365nm

Irradiation head: it shines from the top down

Cooling method: air cooling

Application: reducing the viscosity of UV film / blue film, facilitating the use of the wafer chip in the next operation

Application :

Suitable for optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk and other semiconductor materials, glass filter and others UV film curing, UV tape curing. UV Tape Curing Machine is a UV film and cutting film adhesive tape viscosity reduction and viscosity relief of automatic curing equipment. For materials such as wafers and glass, UV TAPE adhesive is used on 8’’, 12’’, and 15’’ bracket fixture curing device, which has high efficiency curing ability and can quickly reduce the viscosity of UV TAPE on materials and parts.

Characteristics of UV Tape UV Curing Machine :

1.Small body, suitable for 6/8/10/12 inches irradiation

2.Adjustable time and brightness, touch screen operation, simple and convenient

3.Bottom-up irradiation, easy to place the wafer

4.LED cold light source, environmental protection products, with low temperature, uniform exposure, compact structure, small energy consumption, is the ideal model in semiconductor industry, and low temperature no damage to thermally sensitive materials.

5.The service life is more than 10 times longer than ordinary mercury lamp, continuous service life 15000-30000 hours.

6.Zero maintenance cost, no need to replace the illuminant parts for long-term work.

7.Closed light source design, no UV side leakage, no damage to the human body

8.Fast degumming, a few seconds can be degumming, reducing the viscosity of UV film or blue film

Standard 8 Inch UV Tape UV Curing Systems For Wafer Semiconductor

 Product Details

Standard 8inch Wafer Processing Systems is widely used in semiconductor industry. It is often used to reduce the viscosity of the UV film/tape and facilitate the next operation of the wafer.

Parameters:

Dimension	L428*W422*H280 mm	Manufacturer	Shenzhen Deshengxing Electronics Co., Ltd.
Cooling	Air cooling	Input Power	100-240V AC 50-60 HZ
Material	White sheet metal	Compatible with the size	8 inches and under
Size of drawer	L350*W350*H23 mm	Display and Operation	Touch screen display,PLC, English
Set the Lock	Changeable password	Weight	40kg
Intensity	>600mW/cm2	Total Power	1000W
Fixture Size	8 inch	Recommend highly	10~15mm
Cooling	Air cooling	Wavelength	365nm
Function	Adjustable time and intensity	Irradiation direction	From bottom to top
Usage:	Reduce the viscosity of UV film/blue film, convenient for the next step.

Characteristics of Semiconductor UV Tape Curing Machine :

1.Small body, suitable for 4/6/8 inch chip irradiation.

2.Time and brightness adjustable, touch screen operation, simple and convenient.

3.Bottom up irradiation for easy placement of wafers.

4.LED clod light source, environmental protection products, with low temperature, uniform exposure, compact structure, low energy consumption, is the ideal type of semiconductor industry, and low temperature no damage to thermal sensitive materials.

5.Its service life is 10 times longer than that of ordinary mercury lamp. Its continuous service life is 20000h.

6.Zero maintenance cost, long-term work without replacement of lighting source parts.

7.Enclosed light source design, no ultraviolet side leakage, no damage to human body.

12inch UV Tape Curing Systems With Touch Screen Operation Systems

 Product Details

12inch Wafer Film UV Curing Systems is widely used in degumming wafers, like silicon wafers, glass and semiconductor components. Perfect match with the sealing field of the cutting, grinding, thinning process.

Parameters:

Model	DSXUV-Tape-12	Manufacturer	Shenzhen desheng xing Electronics Co., LTD
Outside Dimension	L460.5*W490*H628mm	Capacity of the  drawer	L380mm*W380mm*H7mm
Cool method	Air cooled	Input power	100-240V AC 50-60HZ
Total power	1800W	Wavelength	SVC UV LED 365nm
Compatibility size	12" and under	Illuminance	>600mW/cm²
Display/language	Touch screen English	Function	Adjustable time and illumination
Material/Weight	White sheet metal/bare metal 55kg  including 60kg wooden case	Irradiation direction	To the bottom up

Characteristics:

1.Adopt imported SVC UVLED lights, scientific array arrangement, the uniformity of 95%.

2.When the degumming is finished, there will be a hint light. Red: A fault occurs. Yellow: Waiting to run. Green: It is running.

3.Touch screen operating system, easy to operate.

4.Compatible with multiple size of wafer iron rings. The 12 inch UV Wafer Tape Curing Systems is compatible with 6/8/12 inch wafers and small sizes. Support the cutting process of degumming, grinding degumming, thinning degumming.

Standard Nitrogen 12 Inch UV Tape UV Curing Systems Machine

 Product Details

Standard 12 inch Wafer Film UV Degumming Machine is suitable for degumming wafer, silicon wafer, glass, semiconductor components and other products. Perfect match with the sealing field of cutting, grinding, thinning process.

Information:

Name: Nitrogen UV Tape UV Curing Systems

Type: DSXUV-TapeN-12

Light source: SVC UV LED

Cooling Method: Fan cooling

Outside Dimension: L532*W552*H675mm

Use for Wafer Iron Ring: 12 inch and below

Operation: Touch screen operating

Gross weight: 75KG, including package

Characteristic: Nitrogen protection, real-time illumination monitoring

Manual Wafer Laminating Machine Wafer Backgrinding Mounter 6 8 12 Inches

 Product Details

The special saving film design can greatly reduce the film cost, and equipped with air flexible elastic (elastic adjustable) pressure roller and desk tray design. DSXUV Manual Wafer Lamination Machine not only can adapt to different thickness of the product, can also minimize the film stress, so that the product is not hurt. Easy to use, no training can be used immediately.

Mainly functions of Manual Wafer Lamination System:

1.Suitable for blue film, UV film, PET substrate film and double layer coating

2.Optional micro-porous tray for ultra-thin wafers

3.The heated and elastic plate design adapts to wafers of different thickness

4.Special film roller pressure adjustable design

5.Equipped with circumferential cutter and cross cutter

6.Optional electrostatic removal device for ionic wind rod

7.Small size, desktop display type

DSXUV Manual Wafer Mounter Type:

FM150: 6 inches wafer

FM200: 8 inches wafer

FM300: 12 inches wafer

Technical Specification of Wafer Mounting Machine:

Item	Parameters			Unit	Noted
	FM150	FM200	FM300
Wafer size	3-6	3-8	3-12	inch	Glass, ceramic, LED, PCB can be customized according to the size
Minimize wafer thickness	Normal plate: 150um, micro-porous plate: 100um			um
Frame Dimension	6	6/8	6/8/12	inch
Plate heating temperature range	Indoor temperature ~65	Indoor temperature ~65	Indoor temperature ~655	℃
Component replacement time	＜10	＜10	＜10	minute
Machine dimension	850（D）*390(W)*400(H)	900（D）*450(W)*400(H)	1000（D）*550(W)*400(H)	mm
Power supply	AC220	AC220	AC220	V	50~60HZ
Compressed air	0.5~0.8	0.5~0.8	0.5~0.8	MPa

Saving Film Manual Wafer Laminating System:

Specially designed saving film structure, so that the manual laminating machine series become high saving film manual laminating machine. Compared with ordinary manual laminating machine, it can save about 15%, greatly reducing the cost of customers. The cost savings are even more significant when using expensive UV films now or in the future.

Suitable for ultra-thin wafer micro-porous film plate (optional):

Micro-porous plate is with unique air path design and elastic support structure, suitable for up to 100um thickness wafer, glass or ceramics. This structure is equipped with air flexible elastic, and elastic adjustable roller device can minimize the damage to the ultra-thin wafer during the lamination, greatly reduce the probability of breaking.

Anti-static surface treatment lamination plate with heating function and elasticity:

1.With heating and heating temperature range adjustable plate design, to ensure the film bonding effect can be adjusted to the ideal state.

2.The elastic plate disc adapts to wafers, glass or ceramics of varying thickness

3.The anti-static teflon treatment can not only minimize the static electricity generated during the lamination, but also effectively prevent physical scratches on the chip.