UV Masking Exposure System for Wafer Samples

UV Masking Exposure System for Wafer Samples :
1. Very compact table-top system
2. Perfectly monochromatic at 365nm
3. Hard and soft contact up to wafer
4. Compatible with photoresists

https://www.leduvcuring.com/uv-masking-exposure-system-for-wafer-samples_p100.html

1.Main Specifications

1.1 Size of Frame：6,8,12 inches

1.2 Kinds of Film：UV Film

1.3 Wafer Specification： 12 inches or lower

1.4 Irradiation Light Source：LED Ultraviolet Light Source   Cold Light Source  Wavelength : 365nm。

1.5 Irradiation Intensity：600-1000mW/cm2

1.6 Place Fixture：6,8,12 inches, can switch to one another

1.7 Handling Mode：Manual Take Put

1.8 Product Positioning：a fixture position does not allow it to move

1.9 Electric Power Supply：220V 350W 8A

1.10 Volume(W*L*H)：645mm*620mm*195mm

1.11 Net Weight：40kg

2. Equipment Characteristics

2.1 PLC +Touch Screen  Software Control。

2.2 Irradiation Time Setting 1-999S。

2.3 Temperature monitoring, over set protection temperature, alarm

2.4 Production Capacity : about 200 pieces per hour

2.5 Pre-Nitrogen Flushing

3. Application :

https://www.leduvcuring.com/uv-masking-system_c13

www.leduvcuring.com