6'' 8'' 12'' UV Wafer Tape Curing System

In the semiconductor chip production process, the wafer shall be fixed on the frame with the wafer film before the chip scribing. After the scribing process is completed, LED UV light is used to illuminate the fixed film to make the UV film viscous curing and hardening, so as to reduce the viscosity of the scribing fixed film and facilitate the smooth production of the subsequent packaging process. In other words, UV tape has a strong adhesive strength that will hold the wafer firmly during the wafer grinding or cutting process. When the ultraviolet radiation, the bonding strength becomes low. As a result, the wafer or chip can easily peel off the adhesive tape after being exposed to ultraviolet light. UV Wafer Tape Curing System solves the curing process of wafer, glass and ceramic cutting technology, which is not only limited to semiconductor packaging industry, but also applicable to UV film curing of optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk and other semiconductor materials. UV mercury lamp is commonly used in existing UV curing machines, but the mercury lamp light source with high heat emission is easy to damage thermal sensitive materials, with low efficiency and difficult to accurately control the quality standard, which is not suitable for the irradiation of high precision devices such as chips. The environmentally friendly low temperature LED UV light source curing machine adopted by Guangdong SpaceLight Technology Co., Ltd. can easily finish the UV film curing process without damaging the wafer, which can greatly meet the production requirements.

Parameters of Large UV LED Exposure Machine : 

Host Size of UV Curing Light Chamber	L320*W384*H246.8mm	Weight	6.5kg
Cooling	Air cooling	Input Power	100-240V AC 50-60 HZ
Material	White sheet metal	Drive the Number of Luminous Heads	A light source
Craft	Stoving varnish	Display and Operation	Touch screen display, adjustable time, illumination
Set the Lock	Changeable password	LED Time Accumulation Function	Actively record cumulative usage time

Luminous Dimension of UV LED Exposure Equipment	Diameter : 150mm	Total Power	350W
Fixture Size	5.9 inch	Recommend highly	10~15mm
Cooling	Air cooling	Wavelength	Default 365nm, customizable  385 / 395 / 405
Illuminance	300-2000mW/cm2	Light Source Predicts Service Life	20000 H

Characteristics of Semiconductor UV Tape Curing Machine :

1.Small body, suitable for 6/8/12/15 inch chip irradiation.

2.Time and brightness adjustable, touch screen operation, simple and convenient.

3.Bottom up irradiation for easy placement of wafers.

4.LED clod light source, environmental protection products, with low temperature, uniform exposure, compact structure, low energy consumption, is the ideal type of semiconductor industry, and low temperature no damage to thermal sensitive materials.

5.Its service life is 10 times longer than that of ordinary mercury lamp. Its continuous service life is 15000-30000h.

6.Zero maintenance cost, long-term work without replacement of lighting source parts.

7.Enclosed light source design, no ultraviolet side leakage, no damage to human body.

No.	Content	Parameters
1	Wafer size	6”   8”10” 12‘’  (multiple specifications are available)
2	Light area	Φ150mm, Φ200mm, Φ300mm
3	Nominal voltage	AC 110/220V
4	Frequency	50/60HZ
5	Rated power	350-900W
6	Wavelength of UV Light	365nm-415nm selectable， normal 365nm
7	Dimension （L*W*H）	320mm×384mm×247mm (size customizable)
8	Machine weight	6.5kg
9	Film type	UV film  all kinds of UV Tape
10	Thickness of the film	0.15～2mm
11	Irradiation direction	Bottom up exposure
12	Operating mode	Touch screen operation
13	Timer setting time	Unlimited, adjustable (unit : s)
14	Completion time of curing	Depending on UV tape characteristics (minimum 5s)
15	Exposure intensity setting	20% ~ 100%, adjustable brightness
16	System fittings	Customized according to customer requirements.  Default 5.9 inch.

Please contact us for more details : uvcure@uvspacelight.com (Jennifer)