12inch UV Tape Curing Systems With Touch Screen Operation Systems

 12inch Wafer Film UV Curing Systems is widely used in degumming wafers, like silicon wafers, glass and semiconductor components. Perfect match with the sealing field of the cutting, grinding, thinning process.

Parameters:

Model	DSXUV-Tape-12	Manufacturer	Shenzhen desheng xing Electronics Co., LTD
Outside Dimension	L460.5*W490*H628mm	Capacity of the  drawer	L380mm*W380mm*H7mm
Cool method	Air cooled	Input power	100-240V AC 50-60HZ
Total power	1800W	Wavelength	SVC UV LED 365nm
Compatibility size	12" and under	Illuminance	>600mW/cm²
Display/language	Touch screen English	Function	Adjustable time and illumination
Material/Weight	White sheet metal/bare metal 55kg  including 60kg wooden case	Irradiation direction	To the bottom up

Characteristics:

1.Adopt imported SVC UVLED lights, scientific array arrangement, the uniformity of 95%.

2.When the degumming is finished, there will be a hint light. Red: A fault occurs. Yellow: Waiting to run. Green: It is running.

3.Touch screen operating system, easy to operate.

4.Compatible with multiple size of wafer iron rings. The 12 inch UV Wafer Tape Curing Systems is compatible with 6/8/12 inch wafers and small sizes. Support the cutting process of degumming, grinding degumming, thinning degumming.

DSXUV-Wafer-M6 6 Inches Semiautomatic Wafer Mounter For Dicing UV Film Cutting

 Wafer Tape Laminating Machine is a machine that fixes a wafer and a ring together through a blue film or UV film. The Wafer Frame Film Mounter adsorbs the product on the vacuum plate through vacuum, stretches and covers the thin film on the semiconductor (wafer, glass, LED, PCB), and sticks the thin film on the back of the wafer, namely the cutting rack, through the circular knife and transverse cutter.

The special saving film design can greatly reduce the film cost, and equipped with air flexible elastic (elastic adjustable) pressure roller and desk tray design. DSXUV Manual Wafer Tape Laminating System not only can adapt to different thickness of the product, can also minimize the film stress, so that the product is not hurt. Easy to use, no training can be used immediately.

After finishing wafer mounting process, the next step will need to die matrix expander or using uv curing systems to reduce the viscosity of uv film (UV tape UV curing systems).

Parameters:

Name	Wafer Mounting Machine
Type	DSXUV-Wafer-M6
Wafer Size / Frame Dimension	6 inches
Brand Name	DSXUV
Minimize wafer thickness	Normal plate: 150um, micro-porous plate: 100um
Weight (KG)	60KG gross weight
Plate heating temperature range	Indoor temperature ~65 ℃
Machine dimension	L875*W450*H317mm
Power supply	AC 220V
Usage	The wafer / semiconductor is attached to the wafer iron ring via a UV film
Compressed air	0.5~0.8 MPa
Thickness of Film	0.05～0.25mm

Mainly functions of Manual Wafer Frame Film Lamination System:

1.Suitable for blue film, UV film, PET substrate film and double layer coating

2.Optional micro-porous tray for ultra-thin wafers

3.The heated and elastic plate design adapts to wafers of different thickness

4.Special film roller pressure adjustable design

5.Equipped with circumferential cutter and cross cutter

6.Optional electrostatic removal device for ionic wind rod

7.Small size, desktop display type

Saving Film Manual Wafer Laminating Machine:

Specially designed saving film structure, so that the manual laminating machine series become high saving film manual laminating machine. Compared with ordinary manual laminating machine, it can save about 15%, greatly reducing the cost of customers. The cost savings are even more significant when using expensive UV films now or in the future.

Suitable for ultra-thin wafer micro-porous film plate (optional):

Micro-porous plate is with unique air path design and elastic support structure, suitable for up to 100um thickness wafer, glass or ceramics. This structure is equipped with air flexible elastic, and elastic adjustable roller device can minimize the damage to the ultra-thin wafer during the lamination, greatly reduce the probability of breaking.

Anti-static surface treatment lamination plate with heating function and elasticity:

1.With heating and heating temperature range adjustable plate design, to ensure the film bonding effect can be adjusted to the ideal state.

2.The elastic plate disc adapts to wafers, glass or ceramics of varying thickness

3.The anti-static teflon treatment can not only minimize the static electricity generated during the lamination, but also

effectively prevent physical scratches on the chip.

wafer tape lamination system

DSXUV-Wafer-M8 8 Inches Manual UV Tape Wafer Mounter

 The Wafer Frame Film Mounter is a machine that fixes a wafer and a ring together through a blue film or UV film. The Wafer Mounter adsorbs the product on the vacuum plate through vacuum, stretches and covers the thin film on the semiconductor (wafer, glass, LED, PCB), and sticks the thin film on the back of the wafer, namely the cutting rack, through the circular knife and transverse cutter.

The special saving film design can greatly reduce the film cost, and equipped with air flexible elastic (elastic adjustable) pressure roller and desk tray design. DSXUV Manual Wafer Lamination Machine not only can adapt to different thickness of the product, can also minimize the film stress, so that the product is not hurt. Easy to use, no training can be used immediately.

After finishing wafer mounting process, the next step will need to wafer expander or using uv curing systems to reduce the viscosity of uv tape (UV tape UV curing systems).

Parameters:

Name	Wafer Mounting Machine
Type	DSXUV-Wafer-M8
Wafer Size / Frame Dimension	8 inches
Brand Name	DSXUV
Minimize wafer thickness	Normal plate: 150um, micro-porous plate: 100um
Weight (KG)	60KG
Plate heating temperature range	Indoor temperature ~65 ℃
Machine dimension	L875*W450*H317mm
Power supply	AC 220V
Usage	The wafer / semiconductor is attached to the wafer iron ring via a UV film
Compressed air	0.5~0.8 MPa
Thickness of Film	0.05～0.25mm

Mainly functions of Manual Wafer Lamination System:

1.Suitable for blue film, UV film, PET substrate film and double layer coating

2.Optional micro-porous tray for ultra-thin wafers

3.The heated and elastic plate design adapts to wafers of different thickness

4.Special film roller pressure adjustable design

5.Equipped with circumferential cutter and cross cutter

6.Optional electrostatic removal device for ionic wind rod

7.Small size, desktop display type

Saving Film Manual Wafer Laminating System:

Specially designed saving film structure, so that the manual laminating machine series become high saving film manual laminating machine. Compared with ordinary manual laminating machine, it can save about 15%, greatly reducing the cost of customers. The cost savings are even more significant when using expensive UV films now or in the future.

Suitable for ultra-thin wafer micro-porous film plate (optional):

Micro-porous plate is with unique air path design and elastic support structure, suitable for up to 100um thickness wafer, glass or ceramics. This structure is equipped with air flexible elastic, and elastic adjustable roller device can minimize the damage to the ultra-thin wafer during the lamination, greatly reduce the probability of breaking.

Anti-static surface treatment lamination plate with heating function and elasticity:

1.With heating and heating temperature range adjustable plate design, to ensure the film bonding effect can be adjusted to the ideal state.

2.The elastic plate disc adapts to wafers, glass or ceramics of varying thickness

3.The anti-static teflon treatment can not only minimize the static electricity generated during the lamination, but also

effectively prevent physical scratches on the chip.