DSXUV-Wafer-M8 8 Inches Manual UV Tape Wafer Mounter

 Product Details

The Wafer Frame Film Mounter is a machine that fixes a wafer and a ring together through a blue film or UV film. The Wafer Mounter adsorbs the product on the vacuum plate through vacuum, stretches and covers the thin film on the semiconductor (wafer, glass, LED, PCB), and sticks the thin film on the back of the wafer, namely the cutting rack, through the circular knife and transverse cutter.

The special saving film design can greatly reduce the film cost, and equipped with air flexible elastic (elastic adjustable) pressure roller and desk tray design. DSXUV Manual Wafer Lamination Machine not only can adapt to different thickness of the product, can also minimize the film stress, so that the product is not hurt. Easy to use, no training can be used immediately.

After finishing wafer mounting process, the next step will need to wafer expander or using uv curing systems to reduce the viscosity of uv tape (UV tape UV curing systems).

Parameters:

Name	Wafer Mounting Machine
Type	DSXUV-Wafer-M8
Wafer Size / Frame Dimension	8 inches
Brand Name	DSXUV
Minimize wafer thickness	Normal plate: 500um, micro-porous plate: 100um
Weight (KG)	60KG
Plate heating temperature range	Indoor temperature ~65 ℃
Machine dimension	L875*W450*H317mm
Power supply	AC 220V
Usage	The wafer / semiconductor is attached to the wafer iron ring via a UV film
Compressed air	0.5~0.8 MPa
Thickness of Film	0.05～0.25mm

Mainly functions of Manual Wafer Lamination System:

1.Suitable for blue film, UV film, PET substrate film and double layer coating

2.Optional micro-porous tray for ultra-thin wafers

3.The heated and elastic plate design adapts to wafers of different thickness

4.Special film roller pressure adjustable design

5.Equipped with circumferential cutter and cross cutter

6.Optional electrostatic removal device for ionic wind rod

7.Small size, desktop display type

Saving Film Manual Wafer Laminating System:

Specially designed saving film structure, so that the manual laminating machine series become high saving film manual laminating machine. Compared with ordinary manual laminating machine, it can save about 15%, greatly reducing the cost of customers. The cost savings are even more significant when using expensive UV films now or in the future.

Suitable for ultra-thin wafer micro-porous film plate (optional):

Micro-porous plate is with unique air path design and elastic support structure, suitable for up to 100um thickness wafer, glass or ceramics. This structure is equipped with air flexible elastic, and elastic adjustable roller device can minimize the damage to the ultra-thin wafer during the lamination, greatly reduce the probability of breaking.

Anti-static surface treatment lamination plate with heating function and elasticity:

1.With heating and heating temperature range adjustable plate design, to ensure the film bonding effect can be adjusted to the ideal state.

2.The elastic plate disc adapts to wafers, glass or ceramics of varying thickness

3.The anti-static teflon treatment can not only minimize the static electricity generated during the lamination, but also

effectively prevent physical scratches on the chip.

DSXUV-Wafer-M6 6 Inches Semiautomatic Wafer Mounter For Dicing UV Film Cutting

 Product Details

Wafer Tape Laminating Machine is a machine that fixes a wafer and a ring together through a blue film or UV film. The Wafer Frame Film Mounter adsorbs the product on the vacuum plate through vacuum, stretches and covers the thin film on the semiconductor (wafer, glass, LED, PCB), and sticks the thin film on the back of the wafer, namely the cutting rack, through the circular knife and transverse cutter.

The special saving film design can greatly reduce the film cost, and equipped with air flexible elastic (elastic adjustable) pressure roller and desk tray design. DSXUV Manual Wafer Tape Laminating System not only can adapt to different thickness of the product, can also minimize the film stress, so that the product is not hurt. Easy to use, no training can be used immediately.

After finishing wafer mounting process, the next step will need to die matrix expander or using uv curing systems to reduce the viscosity of uv film (UV tape UV curing systems).

Parameters:

Name	Wafer Mounting Machine
Type	DSXUV-Wafer-M6
Wafer Size / Frame Dimension	6 inches
Brand Name	DSXUV
Minimize wafer thickness	Normal plate: 500um, micro-porous plate: 100um
Weight (KG)	60KG gross weight
Plate heating temperature range	Indoor temperature ~65 ℃
Machine dimension	L875*W450*H317mm
Power supply	AC 220V
Usage	The wafer / semiconductor is attached to the wafer iron ring via a UV film
Compressed air	0.5~0.8 MPa
Thickness of Film	0.05～0.25mm

Mainly functions of Manual Wafer Frame Film Lamination System:

1.Suitable for blue film, UV film, PET substrate film and double layer coating

2.Optional micro-porous tray for ultra-thin wafers

3.The heated and elastic plate design adapts to wafers of different thickness

4.Special film roller pressure adjustable design

5.Equipped with circumferential cutter and cross cutter

6.Optional electrostatic removal device for ionic wind rod

7.Small size, desktop display type

Saving Film Manual Wafer Laminating Machine:

Specially designed saving film structure, so that the manual laminating machine series become high saving film manual laminating machine. Compared with ordinary manual laminating machine, it can save about 15%, greatly reducing the cost of customers. The cost savings are even more significant when using expensive UV films now or in the future.

Suitable for ultra-thin wafer micro-porous film plate (optional):

Micro-porous plate is with unique air path design and elastic support structure, suitable for up to 100um thickness wafer, glass or ceramics. This structure is equipped with air flexible elastic, and elastic adjustable roller device can minimize the damage to the ultra-thin wafer during the lamination, greatly reduce the probability of breaking.

Anti-static surface treatment lamination plate with heating function and elasticity:

1.With heating and heating temperature range adjustable plate design, to ensure the film bonding effect can be adjusted to the ideal state.

2.The elastic plate disc adapts to wafers, glass or ceramics of varying thickness

3.The anti-static teflon treatment can not only minimize the static electricity generated during the lamination, but also

effectively prevent physical scratches on the chip.

6 8 12 Inches Semiautomatic Wafer Expander

 Product Details

Wafer film expander is an equipment, which is used to evenly stretch the tape after the cutting process (Wafer Backgrinding Mounter), so as to separate the chip after cutting and evenly pull apart a certain distance. Adopt servo motor to expand film, the height and speed of expanding film can be set in the touch screen.

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Parameters:

型号  Model	DSXUV-WFE-12	生产厂家Manufacturer	深圳市德胜兴电子有 限公司 Shenzhen desheng xing Electronics Co., LTD
外形尺寸 overall size	L670*W539*H248mm	铁环尺寸 Wafer Ring Size	12 寸 12 inches.
工艺 technology	晶圆、LED等切割后的扩膜工序 Wafer, LED etc. after cutting film expansion process	产品尺寸 Product Size	3-12 寸 3-12 inches
总功率 Total power	500W	输入电源 Input power	100-240V AC 50-60HZ
膜种类 Film Type	PVC膜，蓝膜，UV膜 PVC film, blue film, UV tape	台盘加热范围 working table heating temperature	25-80℃
扩张高度expanding height	10-80mm	压缩空气 compressed air	0.5-0.8MPa

Application:

Wafer film expanding equipment is suitable for IC, Diode, Transistor, Glass, LED, QFN, PCB and other industries. It is suitable for the expansion or stretching process after cutting process in semiconductor integrated circuit chip manufacturing.

Wafer film expander series products are specially used for wafer, LED and other cutting film expansion process, equipped with imported guide rail, temperature control system, can evenly expand the spacing between grains.

Characteristics:

1.Expansion film and wafer can be fixed automatically. Wafer and film can be clamped automatically.

2.The motor rises and pulls the film at a uniform speed and expands evenly

3.Expansion table with heating system

4.Panel device digital display shows the expansion height, according to the product expansion distance to adjust the data

5.Simple mechanism, maintenance free design

6.Suitable for a variety of UV film, PVC, blue film and other materials

Wafer can be isolated and expanded without the need for large frames, saving thin film

Manual UV Tape Expander Machine Die Matrix Expander

 Product Details

Manual Type Semiconductor Wafer Expanding Machine is widely used in expanding UV film on the die grip ring to facilitate the next operation.

DSXUV-EP series type, wafer chip expander, is widely used in the grain expansion process of light-emitting diodes, small and medium power triodes, backlight sources, LED, integrated circuits and some special semiconductor device manufacturers.

Parameters:

Power Voltage: 220V AC 50Hz

Temperature: indoor temperature ~ 350℃

Upper cylinder: 150/200mm

Lower cylinder: 100mm

Extended area: 120/270cm2

Outside dimension: 270*220*820mm (6inch) [Customizable]

Characteristics:

1.Adopt double cylinder up and down control

2.Constant temperature design, uniform and moderate expansion around the diaphragm

3.Heating, stretching, expansion, solid film completed in one time

4.Heat temperature, expansion time and uniformity of return speed are adjustable

5.Simple operation

6.Machine appearance see the real thing

The machine adopts high quality parts, all processed parts are made of high strength aluminum alloy and stainless steel. Ensure the durability of equipment.

Standard 8inch Wafer Expander For LED Semiconductor Chip

 Product Details

Semi-Automatic Wafer Film Expander is an equipment, which is used to evenly stretch the tape after the cutting process, so as to separate the chip after cutting and evenly pull apart a certain distance. Adopt servo motor to expand film, the height and speed of expanding film can be set in the touch screen.

Information:

Name: Wafer Expander

Brand: DSXUV

Size: 8inch wafer iron ring, 8inch hoop ring

Film: UV tape, PVC, Blue film

Application: expanding film for wafer chip, LED and other cutting

Application:

Semiconductor UV Tape Wafer Expanders is suitable for IC, Diode, Transistor, Glass, LED, QFN, PCB and other industries. It is suitable for the expansion or stretching process after cutting process in semiconductor integrated circuit chip manufacturing.

LED Semiconductor Die Matrix Expander series products are specially used for wafer, LED and other cutting film expansion process, equipped with imported guide rail, temperature control system, can evenly expand the spacing between grains.

Characteristics:

1.Expansion film and wafer can be fixed automatically. Wafer and film can be clamped automatically.

2.The motor rises and pulls the film at a uniform speed and expands evenly

3.Expansion table with heating system

4.Panel device digital display shows the expansion height, according to the product expansion distance to adjust the data

5.Simple mechanism, maintenance free design

6.Suitable for a variety of UV film, PVC, blue film and other materials

7.Wafer can be isolated and expanded without the need for large frames, saving thin films

Semiconductor Wafer Chip Grip Ring Plastic Hoops Rings For Wafer Handling

 Product Details

Wafer Die Grip Rrings are made of glass-fiber-reinforced polycarbonate and can be configured as a set of inner and outer rings.Plastic Wafer Expander Rings can be used in semiconductor and LED chip, consisted of inner and outer ring. A reinforced plastic double grip rings are consist of inner and outer rings.Wafer Tape Expansion Rings able to fix wafer to let it expand, provide variety of specs for customer to choose.

Used for :

In-Line Wafer Handling on Expander Rings

Wafer Back Grinding

Wafer Mounting

Wafer Die Sort

Wafer / Die Pick & Place

Wafer / Die Shipping

Wafer expansion after dicing.

Replaces metal dicing frames.

Wafer/film attachment jig

Advantages:

1.  Prevents tapes and films from tearing or breaking.

2.  Eliminates the need to check the direction of the grip ring.

3.  Allows even unskilled operators to do work safely.

4.  The grip rings have no sharp edges that would hurt hands or fingers.

5.  Further, prevent tapes and films from tearing or breaking by eliminating projections (gate) caused by plastic injection.

6.Infinite use without deformation

Features:

- Grip (expander) rings have been designed and produced to exacting tolerances

- Our grip rings are exceptionally strong; made of fiber-reinforced polycarbonate, allowing the rings to better maintain their circular shape

- Dimple marks located on one side of both inner and outer rings provide quick and easy confirmation of correct orientation of grip ring positioning

- Low cost and engineered to last

- Available in red and yellow

-The reusable rings are easy to remove.

Maintain UV LED Curing Lamp Irradiation Head Light Source

 Our advantage: Replacement maintenance modification of various UVLED lamp irradiation head, let you save more costs

It is suitable for drying curing materials of UV ink, UV varnish, UV glue, UV no shadow glue electronic glue circuit board printing

It is suitable for high speed character machine, digital coding machine, PCB circuit board green oil printing, various label printing, soft film gilding UV electronic glue no shadow glue oven curing.

UV curable lamp is widely used for Epson, Ricoh, Konica, Kyocera, Seiko, VARNISH nozzle

The UV LED lamp is equipped with UV LED Chip of 395nm band. It can be customized for other bands or other sizes according to customer requirements.

UV lamps for coding machines, silk screen printing, and flatbed printers for drying UV ink, repaired and replaced UV lamp heads for flatbed printers, silk screen printing, pad printing, and coding machines, and replacement of UV curing lamp heads. We promise that there will be no charge if the repair cannot be done. Our advantage is to replace, repair, and modify various UV LED lamp heads, which can save you more costs.

UV LED curing lamps and water-cooled curing lamp heads are used in flatbed printers, coding machines, photo printers, silk screen printing, pad printing, flexographic printing machines, hot stamping machines, character printers, PCB board printing, and other applications.

Suitable for UV ink, UV oil ink, UV light oil, UV paint, UV adhesive, and UV shadowless glue electronic glue circuit board printing. Suitable for high-speed character printers, digital coding machines, PCB circuit board green oil printing, label printing, soft film hot stamping, UV electronic glue, shadowless glue, oven, and furnace curing.

The UV curing lamp is suitable for Epson, Ricoh, Konica, Kyocera, Seiko, and VARNISH print-heads. The UV LED lamp is equipped with a 395nm UV LED chip by default, and can also provide products of other bands and size specifications according to customer requirements.