Product Details
Wafer Tape Laminating Machine is a machine that fixes a wafer and a ring together through a blue film or UV film. The Wafer Frame Film Mounter adsorbs the product on the vacuum plate through vacuum, stretches and covers the thin film on the semiconductor (wafer, glass, LED, PCB), and sticks the thin film on the back of the wafer, namely the cutting rack, through the circular knife and transverse cutter.
The special saving film design can greatly reduce the film cost, and equipped with air flexible elastic (elastic adjustable) pressure roller and desk tray design. DSXUV Manual Wafer Tape Laminating System not only can adapt to different thickness of the product, can also minimize the film stress, so that the product is not hurt. Easy to use, no training can be used immediately.
After finishing wafer mounting process, the next step will need to die matrix expander or using uv curing systems to reduce the viscosity of uv film (UV tape UV curing systems).
Parameters:
Name | Wafer Mounting Machine |
Type | DSXUV-Wafer-M6 |
Wafer Size / Frame Dimension | 6 inches |
Brand Name | DSXUV |
Minimize wafer thickness | Normal plate: 500um, micro-porous plate: 100um |
Weight (KG) | 60KG gross weight |
Plate heating temperature range | Indoor temperature ~65 ℃ |
Machine dimension | L875*W450*H317mm |
Power supply | AC 220V |
Usage | The wafer / semiconductor is attached to the wafer iron ring via a UV film |
Compressed air | 0.5~0.8 MPa |
Thickness of Film | 0.05～0.25mm |
Mainly functions of Manual Wafer Frame Film Lamination System:
1.Suitable for blue film, UV film, PET substrate film and double layer coating
2.Optional micro-porous tray for ultra-thin wafers
3.The heated and elastic plate design adapts to wafers of different thickness
4.Special film roller pressure adjustable design
5.Equipped with circumferential cutter and cross cutter
6.Optional electrostatic removal device for ionic wind rod
7.Small size, desktop display type
Saving Film Manual Wafer Laminating Machine:
Specially designed saving film structure, so that the manual laminating machine series become high saving film manual laminating machine. Compared with ordinary manual laminating machine, it can save about 15%, greatly reducing the cost of customers. The cost savings are even more significant when using expensive UV films now or in the future.
Suitable for ultra-thin wafer micro-porous film plate (optional):
Micro-porous plate is with unique air path design and elastic support structure, suitable for up to 100um thickness wafer, glass or ceramics. This structure is equipped with air flexible elastic, and elastic adjustable roller device can minimize the damage to the ultra-thin wafer during the lamination, greatly reduce the probability of breaking.
Anti-static surface treatment lamination plate with heating function and elasticity:
1.With heating and heating temperature range adjustable plate design, to ensure the film bonding effect can be adjusted to the ideal state.
2.The elastic plate disc adapts to wafers, glass or ceramics of varying thickness
3.The anti-static teflon treatment can not only minimize the static electricity generated during the lamination, but also
effectively prevent physical scratches on the chip.
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