The Principle of Plasma Cleaning Machine
Plasma is a state of existence of matter. Usually, the substance exists in three states: solid, liquid, and gaseous. However, in some special cases, there is a fourth state, such as substances in the ionosphere in the Earth's atmosphere. The following substances exist in the plasma state: electrons in a high-speed motion state; neutral atoms, molecules, atomic groups (free radicals) in an activated state; ionized atoms, molecules; unreacted molecules, atoms, etc., but substances in the whole It remains electrically neutral. The mechanism of plasma cleaning mainly relies on the "activation" of active particles in the plasma to achieve the purpose of removing stains on the surface of the object. In terms of reaction mechanism, plasma cleaning generally includes the following processes: the inorganic gas is excited into a plasma state; the gas phase substance is adsorbed on the solid surface; the adsorbed group reacts with the solid surface molecule to form a product molecule; the product molecule resolves to form a gas phase; The residue leaves the surface.
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The principle of activation cleaning
A , physical role: particle bombardment on the surface of the material
A large number of active particles in the plasma, such as a large number of ions, excited molecules, and free radicals, act on the surface of the solid sample, which not only removes the original contaminants and impurities, but also produces an etching effect to roughen the surface of the sample. Many fine and uniform topography are formed, which increases the specific surface of the sample and improves the adhesion of the solid surface.
B , cross-linking effect: activation key energy
The energy of the particles in the plasma is between 0 and 20 eV, and most of the bonds in the polymer are between 0 and 10 eV. Therefore, after the plasma acts on the solid surface, the original chemical bonds on the solid surface can be broken. Free radicals form a network of crosslinked structures with these bonds, greatly activating surface activity.
C , chemical action : formation of new functional groups
If a reactive gas is introduced into the discharge gas, a new functional group such as a hydrocarbon group, an amino group, a carboxyl group or the like is introduced, and a complicated chemical reaction occurs on the surface of the activated material, and these functional groups are active groups, which significantly improve the surface activity of the material.
Technical Parameters
| Name | Spray type AP plasma surface treatment system |
| Model (Model) | DSX-APO-RP1020D |
| Power Supply | 220V/AC, 50/60Hz |
| Power (Power) | 800W/25KHz |
| Processing Height | 5-15mm |
| Processing Width | 20-80mm (Option) |
| Internal Control Mode | digital control |
| External Control Mode | RS232 digital communication port, analog control port |
| Working Gas | Compressed Air (0.4Mpa) |
| Nozzle specification | 95mm long, 45mm in diameter |
| Nozzle size (without nozzle part) | 180*85*55 length, width and height |
| Host controller size | 500*185*170mm length, width and height |
| Controller weight | 4kg |
| Nozzle weight 3.7 | Kg |
product advantages
1. Low temperature: close to normal temperature, especially suitable for polymer materials, longer storage time and higher surface tension than corona and flame methods.
2. Strong function: only involves the shallow surface of polymer material ( 10 -1000A ), which can give it one or more new functions while maintaining its own characteristics;
3. Low cost: The device is simple, easy to operate and maintain, and can be operated continuously. Usually, several bottles of gas can replace thousands of kilograms of cleaning fluid , so the cleaning cost will be much lower than the wet cleaning.
4. Full process controllable process: All parameters can be set by PLC and data recording for quality control.
5. Processing geometry is unlimited: large or small, simple or complex, parts or textiles can be processed.
6. The cleaning object is dried after plasma cleaning and can be sent to the next process without drying. Can improve the processing efficiency of the entire process line;
7. Plasma cleaning allows users to stay away from harmful solvents and harm the human body. It also avoids the problem of easy cleaning and cleaning of objects in wet cleaning.
8. Avoid the use of ODS harmful solvents such as trichloroethane , so that no harmful pollutants will be produced after cleaning. Therefore, this cleaning method is an environmentally friendly green cleaning method. This is becoming more and more important when the world is highly concerned about environmental protection;
9. A plasma generated at a high frequency in the range of radio waves. Unlike direct light such as laser light, the directionality of the plasma is not strong, which allows it to go deep into the micro-holes and recesses of the object to complete the cleaning task, so there is no need to think too much about the shape of the object being cleaned. Moreover, the cleaning effect on these difficult-to-clean parts is similar to or better than that of Freon cleaning;
10. Using plasma cleaning, the cleaning efficiency can be greatly improved. The entire cleaning process can be completed in a few minutes, so it has a high yield;
11. Plasma cleaning requires a controlled vacuum of approximately 100 Pa , which is easily achieved. Therefore, the equipment cost of such a device is not high, and the cleaning process does not require the use of a relatively expensive organic solvent, which makes the overall cost lower than the conventional wet cleaning process;
12. The use of plasma cleaning avoids the treatment of transportation, storage and discharge of the cleaning solution, so the production site can be easily kept clean and hygienic;
13. Plasma cleaning can handle a variety of materials, whether it is metal, semiconductor, oxide, or polymer materials (such as polypropylene, polyvinyl chloride, polytetrafluoroethylene, polyacyl). All polymers such as imines, polyesters, and epoxy resins can be treated using plasma. Therefore, it is particularly suitable for materials that are not heat resistant and solvent resistant. Moreover, it is also possible to selectively clean the whole, partial or complex structure of the material;
14. The surface properties of the material itself can be improved while cleaning and decontaminating are completed. Such as improving the wetting properties of the surface, improving the adhesion of the film, etc., is very important in many applications.
15. The cleaning object is dried after plasma cleaning, and can be sent to the next process without drying. Can improve the processing efficiency of the entire process line;
Function :
Plasmas include atoms, molecules, ions, electrons, reactive groups, excited atoms, activated molecules, and free radicals. These particles have high energy and activity, and their energy is sufficient to destroy almost all chemical bonds on any exposed surface. When a chemical reaction is caused and some chemical bonds are opened, a highly active substance such as an oxygen atom is bonded, so that the hydrophilicity of the surface of the material is greatly improved, and a new chemical reaction is formed on the organic macromolecule such as oil on the surface of the material to form a gaseous small molecule. For example, carbon dioxide, water vapor and other gaseous substances are emitted in the air to achieve molecular level cleaning of the surface of the material.
Application :
1> Mainly used in the electronic industry, mobile phone shell printing, coating, dispensing and other pre-treatment, surface treatment of mobile phone screen
2> Aerospace electrical connector surface cleaning for defense industry
3> Screen printing and transfer pre-processing in the general industry
In the rubber and plastics industry, the rubber and plastics industry, the electronics industry, the defense industry, the medical industry, the textile fiber industry.
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