Manual Wafer Laminating Machine Wafer Backgrinding Mounter 6 8 12 Inches

 The special saving film design can greatly reduce the film cost, and equipped with air flexible elastic (elastic adjustable) pressure roller and desk tray design. DSXUV Manual Wafer Lamination Machine not only can adapt to different thickness of the product, can also minimize the film stress, so that the product is not hurt. Easy to use, no training can be used immediately.

Mainly functions of Manual Wafer Lamination System:

1.Suitable for blue film, UV film, PET substrate film and double layer coating

2.Optional micro-porous tray for ultra-thin wafers

3.The heated and elastic plate design adapts to wafers of different thickness

4.Special film roller pressure adjustable design

5.Equipped with circumferential cutter and cross cutter

6.Optional electrostatic removal device for ionic wind rod

7.Small size, desktop display type

DSXUV Manual Wafer Mounter Type:

FM150: 6 inches wafer

FM200: 8 inches wafer

FM300: 12 inches wafer

Technical Specification of Wafer Mounting Machine:

Item	Parameters			Unit	Noted
	FM150	FM200	FM300
Wafer size	3-6	3-8	3-12	inch	Glass, ceramic, LED, PCB can be customized according to the size
Minimize wafer thickness	Normal plate: 150um, micro-porous plate: 100um			um
Frame Dimension	6	6/8	6/8/12	inch
Plate heating temperature range	Indoor temperature ~65	Indoor temperature ~65	Indoor temperature ~655	℃
Component replacement time	＜10	＜10	＜10	minute
Machine dimension	850（D）*390(W)*400(H)	900（D）*450(W)*400(H)	1000（D）*550(W)*400(H)	mm
Power supply	AC220	AC220	AC220	V	50~60HZ
Compressed air	0.5~0.8	0.5~0.8	0.5~0.8	MPa

Saving Film Manual Wafer Laminating System:

Specially designed saving film structure, so that the manual laminating machine series become high saving film manual laminating machine. Compared with ordinary manual laminating machine, it can save about 15%, greatly reducing the cost of customers. The cost savings are even more significant when using expensive UV films now or in the future.

Suitable for ultra-thin wafer micro-porous film plate (optional):

Micro-porous plate is with unique air path design and elastic support structure, suitable for up to 100um thickness wafer, glass or ceramics. This structure is equipped with air flexible elastic, and elastic adjustable roller device can minimize the damage to the ultra-thin wafer during the lamination, greatly reduce the probability of breaking.

Anti-static surface treatment lamination plate with heating function and elasticity:

1.With heating and heating temperature range adjustable plate design, to ensure the film bonding effect can be adjusted to the ideal state.

2.The elastic plate disc adapts to wafers, glass or ceramics of varying thickness

3.The anti-static teflon treatment can not only minimize the static electricity generated during the lamination, but also effectively prevent physical scratches on the chip.