Opening the cover and inserting the wafer to the glass pane, then closing the lid, the UV LED Exposure Machine will start immediately. Curing is completed after about 10-60 seconds, yielding a consistent throughput of 50 to 180 wafers/hour. Fully adjustable exposure dose ranges between 80 mJ / cm2 to 1000 mJ / cm2.
There are numerous UV LED benefits such as less damage to the workpiece by exposure at ambient temperature, a very long lifetime, low power consumption, and safety for replacing the light source because it does not get hot compared to mercury lamps. Equipped with a high-output LED driver, we can achieve an exposure output over 600mW/cm2 (at 6.5mm work distance).
Feature of 6/8/12inch UV Light Curing Machine:
Homogeneous Debonding
Specifications of Silicon Wafer LED UV Curing Equipment :
Frame size: 6/8/12 inches
Types of film: UV film
Wafer: 12 inches and under
Radiation light source: LED UV light source, cold light source, 365nm
Intensity: 600-1000mW/cm2
Place the fixture: 6/8/12 inches wafer can switch with each other
Handling mode: manual put in and take out
Product fixed: alignment pin location
Electric power supply: 220V, 350W,8A
Volume: 645mm*620mm*195mm (L*W*H)
Net weight: 40-50KG
Performance of Dicing UV Flim Degumming Machine:
PLC + touch screen, software control
Irradiation time: 1-999s setting
Production capacity per hour: about 200pcs for general products
Pre-charge nitrogen setting
Key Features of Automatic LED UV Curing Systems :
Low costing procurement = Lowest total cost of ownership (COO)!
No development of harmful ozone
Zero warm-up time
Long service life of UV-LEDs (10,000hrs+)
Low intensity drop (5% in 10,000hours)
No thermal influence on the film
Compact and robust table design
Short installation and implementation time
Low maintenance costs
Conforms to IEC204-1 safety standards
Productivity 50-180 wafer / hr.
No comments:
Post a Comment