Showing posts with label Automatic LED UV Curing Systems. Show all posts
Showing posts with label Automatic LED UV Curing Systems. Show all posts

Friday, July 7, 2023

Full Automatic Nitrogen UV Tape Curing Machine Separate UV Film From Wafer Semiconductor

 Product Details

Automatic UV Wafer Tape Curing Systems are highly efficient and cost-effective semiconductor assembly equipment, high performance UV exposure uniformity and fast curing times.


Advanced circuitry and design with multiple features and options -- coupled with essentially zero downtime -- make DSXUV-N2-250250 Series an ideal choice for fast, uniform, and cost-effective UV LED curing requirements.


UV Curable Dicing Tape Semiconductor Equipment Debond UV Wafer from UV Tape


365nm UV LED Curing System for dicing and back grinding tape


Product Parameters:

Outside dimension

L546.2*W519.63*H376.9mm

Compatible size

250X250mm

Cooling method

Air cooling

Input power

100-240V AC 50-60HZ

Total power

1500W

Wavelength

UV LED 365nm

Drawer capacity

L348mm * W368mm * H15mm

Intensity

>600mW/cm2

Material / Weight

White metal plate / naked machine 50kg

Display

Touch screen

Function

Adjustable time and illumination

Irradiation direction

Bottom-up


UV LED Box Type Curing Machine Reducing UV Tape Adhesive


Operations:

1.Put in the board and close the door

2.Automatically start filling with nitrogen

3.Automatically turn on the light and release the glue after being filled with nitrogen

4.Automatically turn on the light for curing, and turn off the nitrogen after debonding


Applications:

1. Suitable for optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk, thermopile, sensors and other semiconductor materials, glass filter, etc., UV film debonding, UV tape break away from stuffs.

2. UV LED Tape Curing Machine is a kind of UV film and cutting film tape viscosity reduction and viscosity removal of automatic UV LED Curing Equipment.

3. Wafer, crystal round, glass and other materials, using UV tape adhesive for 6inch 8inch 12inch and 15inch of support to handle the glue device, has the efficient unglued ability, can quickly reduce the adhesion of UV tape on materials.


LED UV Curing System Machine Making Diced Device Pick Up Easier


Characteristics :

1.High power UV LED, debonding speed is fast

2.Adjustable time and brightness, touch screen operation, simple and convenient.

3.The addition of nitrogen can exhaust other interfering gases

4.UV LED is cold light source, environmental protection products, with low temperature, uniform exposure, compact structure, low energy consumption, semiconductor industry is the ideal model, and low temperature to thermal-sensitive materials without damage.

5.The service life is more than 10 times longer than that of ordinary mercury lamp, with a continuous service life of 15000-30000h.

6.Zero maintenance cost, no need to replace the light source parts for long-term work.

7.Closed light source design, no ultraviolet side leakage, no damage to human body.


Features :

1. UV irradiation of 365nm wavelength

2. Manual loading, automatic UV process

3. Ideal for low volume and RnD applications

4. Compatible with size of 12’’ version and below

5. Frame or ring curing

6. Special box design to avoid UV leakage.

7. Automatic timing, warning device, easy to operate, high efficiency.

8. The device is heat-resistant and reinforced filter, which blocks the heat source and reduces the high temperature trouble.

9. Special heat sink to protect the lamp and extend the life of the lamp.

Thursday, July 6, 2023

Good Uniformity Of The Scanning UV LED Curing System Machine

 Product Details

Opening the cover and inserting the wafer to the glass pane, then closing the lid, the UV LED Exposure Machine will start immediately. Curing is completed after about 10-60 seconds, yielding a consistent throughput of 50 to 180 wafers/hour. Fully adjustable exposure dose ranges between 80 mJ / cm2 to 1000 mJ / cm2.


There are numerous UV LED benefits such as less damage to the workpiece by exposure at ambient temperature, a very long lifetime, low power consumption, and safety for replacing the light source because it does not get hot compared to mercury lamps. Equipped with a high-output LED driver, we can achieve an exposure output over 600mW/cm2 (at 6.5mm work distance).


Silicon Wafer LED UV Curing Equipment


Feature of 6/8/12inch UV Light Curing Machine: 

Homogeneous Debonding


Specifications of Silicon Wafer LED UV Curing Equipment :

Frame size: 6/8/12 inches

Types of film: UV film

Wafer: 12 inches and under

Radiation light source: LED UV light source, cold light source, 365nm

Intensity: 600-1000mW/cm2

Place the fixture: 6/8/12 inches wafer can switch with each other

Handling mode: manual put in and take out

Product fixed: alignment pin location

Electric power supply: 220V, 350W,8A

Volume: 645mm*620mm*195mm (L*W*H)

Net weight: 40-50KG


12 inches Dicing UV Film Degumming Machine


Performance of Dicing UV Flim Degumming Machine:

PLC + touch screen, software control

Irradiation time: 1-999s setting

Production capacity per hour: about 200pcs for general products

Pre-charge nitrogen setting


12inch Wafer UV Light Curing Machine


Key Features of Automatic LED UV Curing Systems :

Low costing procurement = Lowest total cost of ownership (COO)!

No development of harmful ozone

Zero warm-up time

Long service life of UV-LEDs (10,000hrs+)

Low intensity drop (5% in 10,000hours)

No thermal influence on the film

Compact and robust table design

Short installation and implementation time

Low maintenance costs

Conforms to IEC204-1 safety standards

Productivity 50-180 wafer / hr.


6inch Wafer Semiconductor LED UV Tape Curing Systems


6 inches Automatic LED UV Curing Systems