Product Details
Opening the cover and inserting the wafer to the glass pane, then closing the lid, the UV LED Exposure Machine will start immediately. Curing is completed after about 10-60 seconds, yielding a consistent throughput of 50 to 180 wafers/hour. Fully adjustable exposure dose ranges between 80 mJ / cm2 to 1000 mJ / cm2.
There are numerous UV LED benefits such as less damage to the workpiece by exposure at ambient temperature, a very long lifetime, low power consumption, and safety for replacing the light source because it does not get hot compared to mercury lamps. Equipped with a high-output LED driver, we can achieve an exposure output over 600mW/cm2 (at 6.5mm work distance).
Feature of 6/8/12inch UV Light Curing Machine:
Homogeneous Debonding
Specifications of Silicon Wafer LED UV Curing Equipment :
Frame size: 6/8/12 inches
Types of film: UV film
Wafer: 12 inches and under
Radiation light source: LED UV light source, cold light source, 365nm
Intensity: 600-1000mW/cm2
Place the fixture: 6/8/12 inches wafer can switch with each other
Handling mode: manual put in and take out
Product fixed: alignment pin location
Electric power supply: 220V, 350W,8A
Volume: 645mm*620mm*195mm (L*W*H)
Net weight: 40-50KG
Performance of Dicing UV Flim Degumming Machine:
PLC + touch screen, software control
Irradiation time: 1-999s setting
Production capacity per hour: about 200pcs for general products
Pre-charge nitrogen setting
Key Features of Automatic LED UV Curing Systems :
Low costing procurement = Lowest total cost of ownership (COO)!
No development of harmful ozone
Zero warm-up time
Long service life of UV-LEDs (10,000hrs+)
Low intensity drop (5% in 10,000hours)
No thermal influence on the film
Compact and robust table design
Short installation and implementation time
Low maintenance costs
Conforms to IEC204-1 safety standards
Productivity 50-180 wafer / hr.
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