Nitrogen UV Curing Systems Multiple 6 Inches Wafer Dicing Machine

 Product Details

Automatic Nitrogen UV Curing Systems can curing 4 pieces 150mm diameter wafer. (the chip is coated with a film, which is placed upward).

Product Parameters :

Type	DSXUV-TapeCuring320X320	Manufacturer	Shenzhen Deshengxing Electronics Co., Ltd.
Outside dimension	L532.5*W5.2.91*H379.35mm	Compatible size	320X320mm
Cooling method	Air cooling	Input power	100-240V AC 50-60HZ
Total power	1980W	Wavelength	UV LED 365nm
Capacity of drawer	L368m* W348mm* H15mm	Intensity	>600mW/cm2
Material / weight	White sheet  / naked machine 53kg	Display	Touch screen
Function	Adjustable time and illumination	Irradiation direction	Top-down

Operation :

1.Put it on the board and close the door

2.Automatic start of nitrogen filling

3.After being filled with nitrogen, the lamp will automatically turn on the light operating

4.After the automatic lamp is cured, the lamp is automatically turned off and nitrogen is simultaneously turned off

Please contact customer service for more customized requirements.

Application :

Suitable for optical lens, LED, IC, semiconductor, integrator circuit board, mobile hard disk, thermopile, sensors and other semiconductor materials, glass filter UV film curing, UV tape degumming use. UV Curing Machine is a kind of UV film and cutting film adhesive tape viscosity reduction and removal of automatic UV curing equipment. Wafer, glass and other materials, using UV Tape to glue on 6 / 8 / 12 /15 inches of bracket fixture curing dissolving device, with high efficiency of glue dissolving ability, can quickly reduce the adhesion of UV TAPE on materials.

Characteristics of Nitrogen UV Curing Machine :

1.Multiple wafers can be put into the machine at the same time

2.Adjustable operation time and brightness, touch screen operation, simple and convenient

3.The addition of nitrogen can exhaust other disturbing gases

4.LED cold light source, environmental protection products, with low low temperature, uniform exposure, compact structure, low energy consumption, is the ideal model of semiconductor industry, and low temperature to thermal-sensitive materials without damage

5.The service life is more than 10 times longer than that of ordinary mercury lamp. The continuous service life is 15000~30000 hours

6.Zero maintenance cost, no need to replace the light source parts for long-term work

Full Automatic Nitrogen UV Tape Curing Machine Separate UV Film From Wafer Semiconductor

 Product Details

Automatic UV Wafer Tape Curing Systems are highly efficient and cost-effective semiconductor assembly equipment, high performance UV exposure uniformity and fast curing times.

Advanced circuitry and design with multiple features and options -- coupled with essentially zero downtime -- make DSXUV-N2-250250 Series an ideal choice for fast, uniform, and cost-effective UV LED curing requirements.

Product Parameters:

Outside dimension	L546.2*W519.63*H376.9mm	Compatible size	250X250mm
Cooling method	Air cooling	Input power	100-240V AC 50-60HZ
Total power	1500W	Wavelength	UV LED 365nm
Drawer capacity	L348mm * W368mm * H15mm	Intensity	>600mW/cm2
Material / Weight	White metal plate / naked machine 50kg	Display	Touch screen
Function	Adjustable time and illumination	Irradiation direction	Bottom-up

Operations:

1.Put in the board and close the door

2.Automatically start filling with nitrogen

3.Automatically turn on the light and release the glue after being filled with nitrogen

4.Automatically turn on the light for curing, and turn off the nitrogen after debonding

Applications:

1. Suitable for optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk, thermopile, sensors and other semiconductor materials, glass filter, etc., UV film debonding, UV tape break away from stuffs.

2. UV LED Tape Curing Machine is a kind of UV film and cutting film tape viscosity reduction and viscosity removal of automatic UV LED Curing Equipment.

3. Wafer, crystal round, glass and other materials, using UV tape adhesive for 6inch 8inch 12inch and 15inch of support to handle the glue device, has the efficient unglued ability, can quickly reduce the adhesion of UV tape on materials.

Characteristics :

1.High power UV LED, debonding speed is fast

2.Adjustable time and brightness, touch screen operation, simple and convenient.

3.The addition of nitrogen can exhaust other interfering gases

4.UV LED is cold light source, environmental protection products, with low temperature, uniform exposure, compact structure, low energy consumption, semiconductor industry is the ideal model, and low temperature to thermal-sensitive materials without damage.

5.The service life is more than 10 times longer than that of ordinary mercury lamp, with a continuous service life of 15000-30000h.

6.Zero maintenance cost, no need to replace the light source parts for long-term work.

7.Closed light source design, no ultraviolet side leakage, no damage to human body.

Features :

1. UV irradiation of 365nm wavelength

2. Manual loading, automatic UV process

3. Ideal for low volume and RnD applications

4. Compatible with size of 12’’ version and below

5. Frame or ring curing

6. Special box design to avoid UV leakage.

7. Automatic timing, warning device, easy to operate, high efficiency.

8. The device is heat-resistant and reinforced filter, which blocks the heat source and reduces the high temperature trouble.

9. Special heat sink to protect the lamp and extend the life of the lamp.

Multiple Silicon Wafer UV LED Curing System Machine Separated UV Tape From Wafer Semiconductor

 Product Details

Built to cure wafers up to Φ310mm size, providing 365nm wavelength, ozone free UV irradiation source, timer and status indicator, DSXUV UV LED curing system can make the UV-sensitive tape curing and hardening to reduce its adhesive strength in seconds.

Compared to conventional mercury-arc lamps, it utilizes high-capability LEDs. It enables to process a variety of materials at maximum production speeds and homogeneous illumination, with low-input power requirements.

Open the cover and insert the wafer to the glass pane. Close the lid. The exposure will start immediately. Curing is complete after about 10-60 seconds, yielding a consistent throughput of 50 to 180 wafers/hour. The intensity can be adjustable.

Long term research and development, production of various specifications of UV LED Curing Systems, DSXUV support customized multiple wafer LED UV curing system machine.

Features of multiple channel UV curing systems:

1.Multiple sizes of wafer crystal rings can be placed at the same time, including 6/8/12 inches and other customized sizes

2.Multi-channel design, can simultaneously debonding, also can independently debonding

3.Curing illumination and energy percentage adjustment function, illumination can be adjusted

4.Time to adjust

5.Prompt function after curing

6.It still use ultraviolet radiation from the bottom up the irradiation way, UV radiation directly to the UV film, avoid radiation damage to the wafer crystal element.

7.The enclosed curing light source has no effect on the human body.

8.Ultraviolet for LED packaging form, is no preheating and save time

9.Imported UV LED light source, service life is over 20000 hours