Good Uniformity Of The Scanning UV LED Curing System Machine

 Opening the cover and inserting the wafer to the glass pane, then closing the lid, the UV LED Exposure Machine will start immediately. Curing is completed after about 10-60 seconds, yielding a consistent throughput of 50 to 180 wafers/hour. Fully adjustable exposure dose ranges between 80 mJ / cm2 to 1000 mJ / cm2.

There are numerous UV LED benefits such as less damage to the workpiece by exposure at ambient temperature, a very long lifetime, low power consumption, and safety for replacing the light source because it does not get hot compared to mercury lamps. Equipped with a high-output LED driver, we can achieve an exposure output over 600mW/cm2 (at 6.5mm work distance).

Feature of 6/8/12inch UV Light Curing Machine: 

Homogeneous Debonding

Specifications of Silicon Wafer LED UV Curing Equipment :

Frame size: 6/8/12 inches

Types of film: UV film

Wafer: 12 inches and under

Radiation light source: LED UV light source, cold light source, 365nm

Intensity: 600-1000mW/cm2

Place the fixture: 6/8/12 inches wafer can switch with each other

Handling mode: manual put in and take out

Product fixed: alignment pin location

Electric power supply: 220V, 350W,8A

Volume: 645mm*620mm*195mm (L*W*H)

Net weight: 40-50KG

Performance of Dicing UV Flim Degumming Machine:

PLC + touch screen, software control

Irradiation time: 1-999s setting

Production capacity per hour: about 200pcs for general products

Pre-charge nitrogen setting

Key Features of Automatic LED UV Curing Systems :

Low costing procurement = Lowest total cost of ownership (COO)!

No development of harmful ozone

Zero warm-up time

Long service life of UV-LEDs (10,000hrs+)

Low intensity drop (5% in 10,000hours)

No thermal influence on the film

Compact and robust table design

Short installation and implementation time

Low maintenance costs

Conforms to IEC204-1 safety standards

Productivity 50-180 wafer / hr.

Good Uniformity of the Scanning UV LED Curing System Machine

What Are The Advantages Of Nitrogen UV LED Curing Systems

 Nitrogen UV LED curing oven, also known as inert gas UV curing box, is a new type of UV LED light source, is through the external nitrogen to create a clean and constant temperature environment without oxygen. The nitrogen filled UV LED Curing Chamber developed by DSXUV has a great difference from ordinary UV curing chamber in its internal circulating air duct performance and curing structure. Nitrogen UV LED curing oven is equipped with nitrogen inlet and outlet device, and nitrogen flow meter can more accurately control the flow of nitrogen into the box, with a quick plug and pull charging interface, convenient for nitrogen into, at the same time through the control of nitrogen flow, so that nitrogen can be fully used.

Full Automatic Nitrogen UV Tape Curing Machine Separate UV Film From Wafer Semiconductor

Automatic UV Wafer Tape Curing Systems are highly efficient and cost-effective semiconductor assembly equipment, high performance UV exposure uniformity and fast curing times.

Advanced circuitry and design with multiple features and options -- coupled with essentially zero downtime -- make DSXUV-N2-250250 Series an ideal choice for fast, uniform, and cost-effective UV LED curing requirements.

W : leduvcuring.com

P : +86-18924372460 Jennifer

Same as WhatsApp/Skype.

If necessary, please contact us for detailed specifications and parameters. 

Product Parameters:

Outside dimension	L546.2*W519.63*H376.9mm	Compatible size	250X250mm
Cooling method	Air cooling	Input power	100-240V AC 50-60HZ
Total power	1500W	Wavelength	UV LED 365nm
Drawer capacity	L348mm * W368mm * H15mm	Intensity	>600mW/cm2
Material / Weight	White metal plate / naked machine 50kg	Display	Touch screen
Function	Adjustable time and illumination	Irradiation direction	Bottom-up

Operations:

1.Put in the board and close the door

2.Automatically start filling with nitrogen

3.Automatically turn on the light and release the glue after being filled with nitrogen

4.Automatically turn on the light for curing, and turn off the nitrogen after debonding

Applications:

1. Suitable for optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk, thermopile, sensors and other semiconductor materials, glass filter, etc., UV film debonding, UV tape break away from stuffs.

2. UV LED Tape Curing Machine is a kind of UV film and cutting film tape viscosity reduction and viscosity removal of automatic UV LED Curing Equipment.

3. Wafer, crystal round, glass and other materials, using UV tape adhesive for 6inch 8inch 12inch and 15inch of support to handle the glue device, has the efficient unglued ability, can quickly reduce the adhesion of UV tape on materials.

Characteristics :

1.High power UV LED, debonding speed is fast

2.Adjustable time and brightness, touch screen operation, simple and convenient.

3.The addition of nitrogen can exhaust other interfering gases

4.UV LED is cold light source, environmental protection products, with low temperature, uniform exposure, compact structure, low energy consumption, semiconductor industry is the ideal model, and low temperature to thermal-sensitive materials without damage.

5.The service life is more than 10 times longer than that of ordinary mercury lamp, with a continuous service life of 15000-30000h.

6.Zero maintenance cost, no need to replace the light source parts for long-term work.

7.Closed light source design, no ultraviolet side leakage, no damage to human body.

Features :

1. UV irradiation of 365nm wavelength

2. Manual loading, automatic UV process

3. Ideal for low volume and RnD applications

4. Compatible with size of 12’’ version and below

5. Frame or ring curing

6. Special box design to avoid UV leakage.

7. Automatic timing, warning device, easy to operate, high efficiency.

8. The device is heat-resistant and reinforced filter, which blocks the heat source and reduces the high temperature trouble.

9. Special heat sink to protect the lamp and extend the life of the lamp.

Type Of UV Wafer LED Curing System Machine

 The UV LED Curing Machine are able to debond the UV tape from wafer 12  inch degumming machine

1.Classify by type of ultraviolet light source

traditional mercury lamp UV curing machine and cold light source LED UV curing systems

2.Classify by type of size

According to standard wafer size can be divided into 6 inches/8 inches/12 inches LED UV Curing Equipment

The Wafer-Bonding UV LED Curing Facility made by Shenzhen Deshengxing Electronics Co., Ltd.can be compatible with small size wafer degumming.

If your wafer chips comes in large or small sizes, it is recommended that you purchase only one large size specification.

3.Classify by type of gas

Air type UV LED Curing Equipment and Nitrogen type LED UV Curing Systems

4.Classify by type of the automation process

Automatic UV wafer LED curing machine, semi-automatic UV Tape Curing System Machine and manual LED UV Curing System Equipment.

Why do UV LED Curing Machine Need to Fullfill Nitrogen (N2)

 Nitrogen UV LED Curing Machine is also a system engineering, integrated with nitrogen protection system, but also integrated with other UV Irradiation Systems of the main body, such as the UV LED light module, drive control, air cooling system and other parts. Because of its higher technology, it is more difficult to manufacture. But compared with the original Wafer-Bonding UV Curing Machine, the LED UV Light Curing Equipment with Nitrogen protection will be better in the ungluing efficiency. The main reason is that the original Wafer-Bonding UV Curing Machine exists in the air between the luminous source and the irradiated object, the oxygen contained in the air will have dust. And when the UV emits ultraviolet light, water vapor and oxygen will be produced between the emitting body and irradiated object, which will reduce the energy of ultraviolet light and thus reduce the UV degumming effect. However, with nitrogen protection, the air is completely isolated so that there is no air between the light source and the object to be cured. So the efficiency of curing effect will be higher and more thorough.

Nitrogen (N2) is a kind of inert gas, is a protective gas, so it is called “nitrogen protection”. Nitrogen is chemically inert. Its molecules are larger than those of oxygen. It is usually a colorless, odorless gas and is generally less dense than air. Nitrogen, which accounts for 78.12% (volume fraction) of the total atmosphere, is the major component of air. Nitrogen reacts poorly with other substances at room temperature. Nitrogen is not easy to expand and contract in heat and cold, and its deformation range is small. Based on nitrogen’s various chemical properties and mechanical properties are better than air, Shenzhen Deshengxing Electronics Co., Ltd. studies the use of nitrogen filled LED UV Light Curing Equipment to discharge oxygen. Shenzhen Deshengxing Electronics Co., Ltd. research of the nitrogen protection in the glue machine refers to the establishment of a relatively closed space in the LED UV Light Curing Machine, the use of nitrogen N2 filled into it, thus greatly reducing the oxygen in the air and water vapor on the UV light source polymerization reaction. Because oxygen and water vapor will be involved in UV LED chemical reaction, loss of UV energy, ozone and affect the chemical reaction of photosensitizer.

The “nitrogen protection system” greatly improves the efficiency of UV degumming and thus greatly improves a series of problems inherent in UV Irradiation Systems of traditional mercury lamp sources. In addition, the speed and uniformity of degumming process are also improved, that is, more kinds of UV films can be degumming without worrying about the effect of degumming.

How To Detach a Wafer From The UV Tape By Using a UV LED Curing Light Systems

 Before the chips scribing, the wafer is fixed to the frame with scribing film. After the scratching process is completed, UV light is used to irradiate the fixed film to make the UV film solidify and harder, so as to reduce the stickiness of the scratching fixed film and facilitate the smooth production of subsequent packaging processes. In other words, the UV tape has a strong adhesive strength and holds the wafer firmly during the wafer grinding process or the wafer cutting process. When ultraviolet LED light radiation, the bonding strength will be reduced. As a result, the wafer or chip can easily peel off the tape after UV LED Light exposure. UV LED Curing Systems Machine solves the degumming process of wafer, glass and ceramic cutting process. It is not only commonly used in semiconductor packaging industry, but also for the use of UV film degumming of semiconductor materials such as optical lens, LED, IC, semiconductor, integrated circuit board and mobile hard disk. The UV curing systems in the prior art mostly uses UV mercury lamp. The light source of UV mercury lamp with high heat emission is easy to be damaged by heat sensitive materials, and its efficiency is low, and its quality standard is difficult to be controlled accurately, so it is not suitable for high precision devices such as chips. Shenzhen Deshengxing Electronics Co., Ltd. adopts the environment-friendly low-temperature LED UV Curing Light Source Systems, easy to complete the UV film de-film process, and does not damage the wafer, greatly meet the production needs.

The details of "What is UV Film? UV Adhesive Principle"

Application :

Suitable for optical lens, LED, IC, semiconductor, integrated circuit board, mobile hard disk and other semiconductor materials, glass filter UV film degumming, UV tape degumming use. UV LED Curing Systems is a kind of UV film and cutting film tape viscosity reduction and viscosity removal of automatic curing equipment. The wafer, glass and other materials can be pasted on 6’’, 8’’ and 12’’ brackets with adhesive dissolving device, which has high efficiency of adhesive dissolving ability and can quickly reduce the stickiness of UV Tape on materials.

What Is UV Film? UV Adhesive Principle

 UV film is a special formula UV coating on coated PET, P0, PVC, EVA film base material surface, is a specially designed for semiconductor chips, special optical glass (wafer of silicon, filter glass), special metal and ceramic substrates and flexible electronics and some small thin fragile parts processing production of fixed, protection, bearing with designed a new type of adhesive products. This material adopts specially polyolefin (PO) and polyester (PET) film as raw material, coated with special adhesive, through dust-free high temperature coating process. UV film with high adhesion, high tensile strength, adaptability, balanced extension and other characteristics, easy to fix some small particles or fragile ultra-thin sheet, so that the material in the grinding, processing and cutting process does not slide, do not fly, no water seepage. At the end of the processing, the UV film after a specific ultraviolet energy irradiation to make the tape lose adhesion, it is easy to separate the product from the tape, and no damage, no residue, very good to meet the semiconductor and optical industry special materials processing process. UV tape can be customized according to customer requirements of various thickness, viscosity and processing customer required shape and size. The principle of UV adhesive is mainly concentrated in the adhesive formula to add a photo-initiator, so that it in a specific value of UV LED light curing, trigger the internal function, making the original high adhesive surface suddenly lose viscosity, so as to meet the requirements of the process.

12 Inches Cutting Scratches Transport Fixed Silicon Disk Iron Ring Frame Special For Blue Film

 Stainless Steel 12’’ Wafer Ring Metal Film Frame is selection of materials through SGS certification, high bending strength, high hardness, can bear high load, high wear, corrosive media. 12 inches Blue Film Attachment Wafer Ring is with strong hardness, resistance to bending, good stickiness, durability.

Product information for Stainless Steel Wafer Chip Rings :

Brand : DSXUV

Name : wafer chip ring

No. : DSMTQE12-000-R0

Material : SUS420j2 (stainless steel)

Specification : 12 inches (OD 379.8*380.4mm, ID R177.6mm)

Application : it can be widely used in semiconductor wafer packaging, film coating, cutting, solid crystal and other processes in electronics factory.

Product features of Semiconductor Wafer Ring Metal Frame :

1. Heat treatment process of selected raw material

SUS420J2 imported material, with good corrosion resistance, heat resistance. The product has good resistance to rebound after heat treatment.

2. Surface electropolishing treatment

The surface is polished, the surface flatness can reach above ±0.01mm, the finish RX value can reach above 0.08um, can keep clean and beautiful for a long time.

3. Laser cutting with high accuracy

Advanced laser cutting machine is with high cutting accuracy, shape tolerance according to GB/T1184-K, size tolerance according to GB/T1804-M standard processing molding.

Applications of 12’’ Disco Wafer Frame Ring :

Bearing silicon wafers used in semiconductor packaging or LED packaging process : film/wafer mount, grinding/back grinding, cutting/die saw, bonding(solid crystal)/die attach, turnaround transport and other processes.