12 Inches LED UV Tape Curing System Machine Debonding Tape From Wafer Semiconductor Chips

 Product Details

DSXUV-Tape-Curing UV Curing Systems are the most cost-effective UV tape exposure solutions on the market. Not merely their low cost, these units offer the same uniformity of UV exposure and fast UV curing times as other semiautomatic and automatic high-end UV curing systems. In addition, the Models DSXUV-Tape-Curing feature a new environmentally safe, ozone-free UV LED light beads array with a cool, low-temperature UV-A 365nm curing process.

Product Parameters :

Model	DSXUV-Tape-Curing-12	Manufacturer	Shenzhen Deshengxing Electronics,Co.,Ltd.
Outside dimension	L483.5*W469.54*H400.25mm	Compatible with the size	12 inches or less
Cooling	Air cooling	Input power	100-240V AC 50-60HZ
Total power	600pcs x3W=1800W	Wavelength	UV LED 365nm
Capacity of drawer	L392mm W384mmH7mm	Intensity	>600mW/cm2
Material / Weight	White sheet metal /naked machine50kgpackaging55kg	Display / Language	Touch screen / English
Function	Adjustable time and illumination	Irradiation direction	Bottom-up

Debonding tape area from a semiconductor wafer ring is 305mm

Suitable iron ring specification, 12 inches Wafer Ring Size, can be compatible with small size.

Features :

1.Small body, suitable for 6/8/10/12 inches wafer chips irradiation use

2.Time and brightness can be adjusted, touch screen operation, simple and convenient

3.Light from bottom to top for easy placement of wafers

4.LED cold light source, environmental protection product, with low temperature, uniform exposure, compact structure, small energy consumption, is the ideal model for semiconductor industry, and low temperature does not damage to thermal sensitive materials

5.The service life is more than 10 times longer than that of traditional mercury lamp, and the continuous service life is 15000-30000 hours

6.Zero maintenance cost, no need to replace the illuminant parts for long-term work.

7.Closed light source design, no damage to human body

8.Fast curing, tape can be bonded from wafer chips in few seconds

9.It can be compatible 12 inches or small sizes.