Friday, July 7, 2023

12 Inches LED UV Tape Curing System Machine Debonding Tape From Wafer Semiconductor Chips

 Product Details

DSXUV-Tape-Curing UV Curing Systems are the most cost-effective UV tape exposure solutions on the market. Not merely their low cost, these units offer the same uniformity of UV exposure and fast UV curing times as other semiautomatic and automatic high-end UV curing systems. In addition, the Models DSXUV-Tape-Curing feature a new environmentally safe, ozone-free UV LED light beads array with a cool, low-temperature UV-A 365nm curing process.


12 inches UV Curing Systems Debond Tape from Wafer


Product Parameters :

Model

DSXUV-Tape-Curing-12

Manufacturer

Shenzhen Deshengxing Electronics,Co.,Ltd.

Outside dimension

L483.5*W469.54*H400.25mm

Compatible with the size

12 inches or less

Cooling

Air cooling

Input power

100-240V AC 50-60HZ

Total power

600pcs x3W=1800W

Wavelength

UV LED 365nm

Capacity of drawer

L392mm W384mmH7mm

Intensity

>600mW/cm2

Material / Weight

White sheet metal /naked machine50kgpackaging55kg

Display / Language

Touch screen / English

Function

Adjustable time and illumination

Irradiation direction

Bottom-up


Debonding tape area from a semiconductor wafer ring is 305mm

Suitable iron ring specification, 12 inches Wafer Ring Size, can be compatible with small size.


UV Light Curing Systems Unglue Tape from Wafer Chips


Features :

1.Small body, suitable for 6/8/10/12 inches wafer chips irradiation use

2.Time and brightness can be adjusted, touch screen operation, simple and convenient

3.Light from bottom to top for easy placement of wafers

4.LED cold light source, environmental protection product, with low temperature, uniform exposure, compact structure, small energy consumption, is the ideal model for semiconductor industry, and low temperature does not damage to thermal sensitive materials

5.The service life is more than 10 times longer than that of traditional mercury lamp, and the continuous service life is 15000-30000 hours

6.Zero maintenance cost, no need to replace the illuminant parts for long-term work.

7.Closed light source design, no damage to human body

8.Fast curing, tape can be bonded from wafer chips in few seconds

9.It can be compatible 12 inches or small sizes.


12 inches Wafer Semiconductor UV Curing System Equipment

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