Product Details
6 inches Iron Ring Wafer Frame is strong hardness, resistance to bending, good stickiness and durability, widely used in semiconductor packaging, film, cutting, adhesive process bearing appliances.
Parameters of 6 inches Wafer Iron Rings :
Brand : DSXUV
Name : wafer chip ring
No. : DSMTQA06-000-R0
Material : SUS420j2 (stainless steel)
Specification : 6 inches (OD 228mm, ID 194mm)
Application : it can be widely used in semiconductor wafer packaging, film coating, cutting, solid crystal and other processes in electronics factory.
Features of Wafer Metal Frame :
1. Anti-folding, anti-corrosion and anti-scratching
Flatness : ≤0.2mm hardness : 50-55HRC
2. Heat treatment process
Wafer ring has good resistance to rebound after heat treatment
3. Precision machining precision
Wafer Iron Ring using laser cutting machine, cutting error is small.
4. Compatible with various packaging devices
Compatible with frame processing device (Disco, TSK, ADT, etc.)
5. Quality assurance durable
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