Product Details
Standard 12 inch Wafer Film UV Degumming Machine is suitable for degumming wafer, silicon wafer, glass, semiconductor components and other products. Perfect match with the sealing field of cutting, grinding, thinning process.
Information:
Name: Nitrogen UV Tape UV Curing Systems
Type: DSXUV-TapeN-12
Light source: SVC UV LED
Cooling Method: Fan cooling
Outside Dimension: L532*W552*H675mm
Use for Wafer Iron Ring: 12 inch and below
Operation: Touch screen operating
Gross weight: 75KG, including package
Characteristic: Nitrogen protection, real-time illumination monitoring
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